chiplet-summit.com

Chiplet USA 2026 is a professional conference focused on advanced packaging and chiplet ecosystems, bringing together semiconductor experts, industry partners, and researchers to share insights on 2.5D/3D integration, UCIe interconnects, and modular chiplet designs. The event highlights practical case studies, expert speakers, and opportunities for sponsorship and collaboration, offering attendees a venue to deepen their chiplet strategy and connect with the wider ecosystem.